Downsize die to fit your Prober, SEM or TEM sample holder without any “cracking” risk

A controlled, precise cleaving process allows you to downsize repeatedly in <1-min. No skills required and no pre-prep. Single step for thin samples (‘out-of-a-package’ die or backthinned sample): microline indent to cleave, eliminating the cleaving step and for thicker samples (or die on a host), 2 steps process, microline indent + 3-point cleave - die touchless.

A controlled, precise cleaving process allows you to downsize repeatedly in <1-min. No skills required and no pre-prep. Single step for thin samples (‘out-of-a-package’ die or backthinned sample): microline indent to cleave, eliminating the cleaving step and for thicker samples (or die on a host), 2 steps process, microline indent + 3-point cleave - die touchless.

See All Use Cases ▶

Featured Use Case ▶

Rotated Lithography

Cleaving structures printed at 45 degrees

Featured Use Case ▶

Use the scriber to make 1 mm samples

Cleaving and Scribing Small Samples

Featured Use Case ▶

Copper bumps after cleave

Cleaving Copper C4 Bumps

Featured Use Case ▶

Downsize die to fit your Prober, SEM or TEM sample holder without any “cracking” risk

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