Cleaving Copper C4 Bumps

This sample was prepared by using a Multi-tool workflow. The preparation yielded a high-quality cross section ready for SEM imaging. The solder bumps were prepared for the SEM in a two-step process. In step 1, the LatticeAx cleaver was used to cleanly cross-section close to and parallel to a specific row of copper bumps. In step 2, a broad, argon, ion-beam instrument, the Hitachi IM4000, was used to prepare the final imaging surface. No further preparation was performed.

This sample was prepared by using a Multi-tool workflow. The preparation yielded a high-quality cross section ready for SEM imaging. The solder bumps were prepared for the SEM in a two-step process. In step 1, the LatticeAx cleaver was used to cleanly cross-section close to and parallel to a specific row of copper bumps. The copper bumps had a diameter of 85 μm and were cleaved 30 μm from the center of a bump. The time to cleave was 5 minutes. In step 2, a broad, argon, ion-beam instrument, the Hitachi IM4000, was used to prepare the final imaging surface. The sample was mounted topside down on a sample block to perform backside milling. Backside milling was used to prevent artifacts of ion beam milling that can occur as a result of sample topography. By cleaving close to the center of the copper bumps, the time on the ion mill was minimized. No further preparation was performed.

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Rotated Lithography

Cleaving structures printed at 45 degrees

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Cleaving and Scribing Small Samples

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Copper bumps after cleave

Cleaving Copper C4 Bumps

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Downsize die to fit your Prober, SEM or TEM sample holder without any “cracking” risk

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