Cleaving structures printed at 45 degrees

The LatticeAx was used to cleave a specific site on the sample without the luxury of features that are aligned perpendicular to the sample’s leading edge. Although the silicon is <100> the pattern shown is rotated 45 degrees. This makes it more challenging to target features. A process was developed to target the area of interest and cleave.

For the best targeting accuracy, the sample must have a clean leading edge. If the leading edge is not straight or is too rough, the target will be missed unless it is very close to to the indent. For all <100> silicon, the direction of the cleave will always be 90 degrees to the leading edge. This property allows the direction of the cleave and location of the target to be visualized by drawing a line perpendicular to the leading edge. The indent is made on the surface of the silicon and on top of the drawn line. The cleave propagates from the indent, perpendicular to the leading edge of the sample.

Additional Info

LatticeGear applications note: Cleaving SIlicon with 45 degree lithography


See All Use Cases ▶

Featured Use Case ▶

Rotated Lithography

Cleaving structures printed at 45 degrees

Featured Use Case ▶

Use the scriber to make 1 mm samples

Cleaving and Scribing Small Samples

Featured Use Case ▶

Copper bumps after cleave

Cleaving Copper C4 Bumps

Featured Use Case ▶

Downsize die to fit your Prober, SEM or TEM sample holder without any “cracking” risk

© 2019 LatticeGear, LLC

Login or Create an Account

Close ×

Create an Account

Setting up an account will only take a minute. BTW, We don't store any credit card info. We keep only enough info just so you can review past purchases.