Cleave and SEM Single-Tool Use Case: SEMATECH TSVs

Samples were cleaved and imaged directly in the SEM. Because TSVs can be up to 100 microns deep with aspect ratios of up to 1:20 or greater, cross-sectional examination in the SEM is the analysis method of choice. Cleaving is a fast, clean method of preparing TSV samples for inspection.

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Rotated Lithography

Cleaving structures printed at 45 degrees

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Use the scriber to make 1 mm samples

Cleaving and Scribing Small Samples

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Copper bumps after cleave

Cleaving Copper C4 Bumps

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Downsize die to fit your Prober, SEM or TEM sample holder without any “cracking” risk

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