Cleaving and Scribing Small Samples

LatticeGear’s FlipScribe and LatticeAx cleaving machines offer flexibility to prepare samples as small as 1mm.

​The thin samples were prepared by first cleaving the cross section face. The thin strip was then prepared by using the FlipScribe to scribe the entire length of the back side of the sample and then cleaving using the diamond tip.

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Featured Use Case ▶

Rotated Lithography

Cleaving structures printed at 45 degrees

Featured Use Case ▶

Use the scriber to make 1 mm samples

Cleaving and Scribing Small Samples

Featured Use Case ▶

Copper bumps after cleave

Cleaving Copper C4 Bumps

Featured Use Case ▶

Downsize die to fit your Prober, SEM or TEM sample holder without any “cracking” risk

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