Use Cases

The LatticeAx fills the need for accurate cleaving with a low cost of entry and high flexibility in sample size, thickness and material. With 10-20 micron targeting accuracy, it meets the needs of many applications and results in a high quality cross-section by any user. It takes little training and users will be “CLEAVING IN MINUTES AND EXPERTS IN A DAY.”

Cleaving and Scribing Small Samples

LatticeGear’s FlipScribe and LatticeAx cleaving machines offer flexibility to prepare samples as small as 1mm.

« Featured Use Case »

Cleaving structures printed at 45 degrees

The LatticeAx was used to cleave a specific site on the sample without the luxury of features that are aligned perpendicular to the sample’s leading edge. Although the silicon is <100> the pattern shown is rotated 45 degrees. This makes it more challenging to target features. A process was developed to target the area of interest and cleave.

Downsize die to fit your Prober, SEM or TEM sample holder without any “cracking” risk

A controlled, precise cleaving process allows you to downsize repeatedly in <1-min. No skills required and no pre-prep. Single step for thin samples (‘out-of-a-package’ die or backthinned sample): microline indent to cleave, eliminating the cleaving step and for thicker samples (or die on a host), 2 steps process, microline indent + 3-point cleave - die touchless.

Multi-Tool Use Case: Die Attached to Host Substrate

The original die was depackaged, too thin to handle any other way, the die was attached to a host substrate. The LatticeAx was used to downsize the sample in preparation for further processing. The indent was created on the host substrate. No special process was used to indent and cleave the sample.

Cleaving Copper C4 Bumps

This sample was prepared by using a Multi-tool workflow. The preparation yielded a high-quality cross section ready for SEM imaging. The solder bumps were prepared for the SEM in a two-step process. In step 1, the LatticeAx cleaver was used to cleanly cross-section close to and parallel to a specific row of copper bumps. In step 2, a broad, argon, ion-beam instrument, the Hitachi IM4000, was used to prepare the final imaging surface. No further preparation was performed.

Cleave and SEM SIngle-Tool Use Case: Photoresist

Photoresist, because it is soft, makes it difficult to cross section mechanically or with the FIB. The best solution is to cleave the sample and image it directly in the SEM. This makes the LatticeAx the perfect tool for sample preparation of photoresist cross sections. The resist structure is not changed in the process and the simple cleave is achieved in <5 minutes.

Cleave and SEM Single-Tool Use Case: Depackaged Device

The packaged device was first removed, in tact, from the package and then cleaved with the LatticeAx. The sample was imaged in the SEM using variable pressure mode. Note the cleanliness of the cleave even with the conformal coating on the surface. The imaging was good enough to verify the quality of the tungsten fill. This preparation could be following with FIB if greater accuracy was required.

Cleave and SEM Single-Tool Use Case: Depackaged Microprocessor

This 65 nm microprocessor was deprocessed and then cleaved using the LatticeAx. This was a quick way to downsize the microprocessor into uniform pieces for direct imaging the SEM. Specific regions were targeted.

Cleave and SEM Single-Tool Use Case: Etched TSVs

Optical and SEM images of etched TSVs. Note the clean cleave with mirror finish. The long cleave enables inspection of many vias. SEM image at 10kV in SE mode.

Multi-Tool Use Case: SEMATECH Copper Filled TSVs

For copper filled TSVs SEMATECH recommends cross section samples be prepared by first cleaving through the via and then polishing mechanically or with ion beam instruments to planarize the cross section face.

Beyond Silicon: Cleaving Sapphire

Fast Cleave of a sapphire wafer. The first cleave was perpendicular to the wafer flat. Images on the left show the quality of a manual cleave. The images on the right show the quick, clean cleave using the LatticeAx to indent and cleave the sapphire wafer.

LatticeAx Cleaves Hard Disc

The cross-section is straight and clean from the leading edge with no chipping

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