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Cleaving Kit-with mat

SKU #CSK-200M-LG

Price: $320.00



Non-USA Orders

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Description

The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes a large wafer mat, two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving. This kit wide is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).

Details

The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes a large wafer mat, two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving, pliers for cleaving. This kit wide is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).

The standard configuration includes one each:

  1. Diamond Scribe-Pen style
  2. Diamond Scribe-straight tip
  3. Diamond Scribe- 30 degree tip
  4. Tweezers with black soft fiber fine tip (length 6 ¼”)
  5. CleanBreak Pliers-Wafer cleaving pliers.
  6.  Large 18X12" Cutting Mat-Self healing, wafer cutting mat
  7. Small ruler mat-Self healing, Small wafer piece ruler mat
  8. Clear plastic ruler with metric and US units
  9. Tungsten cleaving wire


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