See LatticeGear at IPFA 2016 in Singapore
July 08, 2016
Stop by the LatticeGear booth at IPFA 2016 in Singapore to learn how our unique, smart manual cleaving and scribing solutions will maximize your sample preparation productivity and increase throughput. Demo the LatticeAx and FlipScribe at our booth, or attend one of our in-booth and symposium presentations to see how LatticeGear solutions are helping many of the world’s semiconductor and materials science labs get to the business of analysis faster.
- Improvement of Top-Down Delayering Techniques on Advanced Technology Nodes, Session 7B, Parallel Session 1 (Jasmine 3812), 10:35-10:55
- Downsize Full Wafers while Maintaining Die Row and Column Locations, Vendor Exhibit Booth A06, 12:30 - 12:45
- Exhibitors’ Presentation III, Plenary Room (Jasmine 3812), 13:00-14:00
- A Novel Single Indent-to-Cleave Method for Sectioning Die, Vendor Exhibit Booth A06, 13:00-13:15
IPFA is being held at the Marina Bay Sands in Singapore, July 18 - 21, 2016. More information can be found at http://ieee-ipfa.org/2016/