See LatticeGear at ESREF 2015, October 5 - 8.
August 23, 2015
Visit LatticeGear at booth 2 to learn about our low cost, high accuracy cleaving (HAC) and scribing methods for cross sectioning targets to 10 µm accuracy without altering the properties of the sample. Be sure to attend our Mini-Workshop, New Methodologies for High Accuracy Cleaving (HAC) and Scribing to Speed Time to Analysis Ready Samples. Or schedule a personal demonstration to see for yourself how HAC can improve your sample preparation throughput. LatticeGear will also be delivering a presentation, Efficient Sample Prep Workflow with a New Cleaving Methodology, in the sample preparation session of EFUG, the European FIB Users Group meeting, on Thursday, 8 October.