LatticeGear ships multiple tools to wafer fabricaton equipment supplier
February 12, 2014
LatticeGear received a repeat order from a California based, major supplier of wafer fabrication equipment and services to the worldwide semiconductor industry. The first LatticeAx 200 was ordered and shipped Q4 2013. In February 2014 the 2nd order for LatticeAx220 was received. Focusing on etch, thin film deposition and photoresist strip equipment, cleaving is the ultimate cross section method as it doesn’t alter the results. The purchase fulfills the need to increase cleaving capacity by extending manual cleaving capabilities and complement existing tools including an automated cleaving tool.