Attend a lunchtime tutorial offered by Hitachi and LatticeGear at M&M 2015
July 23, 2015
Join us on Tuesday, August 4, from 12:00 - 1:00pm, at Hitachi High Technologies America, booth 1376, for “Streamlining Cross Section Sample Preparation.” This tutorial will present and demonstrate a cross section sample preparation workflow that combines High Accuracy Cleaving (HAC) and Broad Ion Beam (BIB) milling for high quality sub-surface observation. This combination of the LatticeAx cleaving systems along with the Hitachi IM4000 Broad Ion Beam system delivers the best throughput for any lab without sacrificing quality, at a cost that rivals traditional methods and fully automated systems.
Contact us to request your invitation, or visit the Hitachi booth during M&M to secure your spot.