LatticeAx 420

LatticeAx420 is LatticeGear’s highest performance cleaving solution. It integrates LatticeGear’s custom designed, stable, small footprint workstation and vision package with 4-μm optical resolution and precise focus control to cleave with 10-um accuracy in <5-min.


LatticeGear's Highest Performance Cleaving System

LatticeAx420 is LatticeGear’s highest performance cleaving solution.  It delivers a cleaving accuracy of 10-μm in <5 min.  The patent pending LatticeAx base is integrated with a complete vision package that includes a monocular microscope with 4-μm optical resolution, color CCD camera and real-time image acquisition and display software, as well as , X-Y stage.  This dedicated cleaving workstation is used to survey, align, micro-indent, cleave, and inspect any sample by any user.

The LatticeAx 420 Features

​Accuracy

10-um

Vision Package

A Navitar Zoom 12X monocular microscope with continuous zoom (.58-7X) and fine focus coupled with an ultra-compact UXGA 1600x1200 pixel color USB CCD camera with image display software*. The package also integrates a robust, coarse and fine focusing mount and fiber optic ring lighting.

LatticeAx 420 Package:

  • LatticeAx
  • 1 pre-installed Indenter
  • Vision package
  • Robust setup integrated into a single platform: 11x13” heavy duty work-surface with coarse/fine focus, X-Ysample positioning stage
  • Vacuum Pump

Voltage

110 or 220.  Price varies, so please specify when requesting a quote.

*Computer not included

Every LatticeAx Features

Set Samples

Flat stage with vacuum to hold the sample in place during indentation.

Indentation

Using the indenter knob, create a pristine, controlled surface indentation: L-1mm (from leading edge), W- 10um, D- shallow / user selection.

3-Point Cleaving Process

Using the cleaving bar and turning knob, cleave slowly and controllably perpendicular to the primary sample axis, from the indentation.

Minimum Sample Size

Full set-indent-cleave – min 9mm width / For < 9mm, use the Ax to set-indent

Maximum Sample Size

1/2 of 12” wafer

Thickness of Sample

‘out of the package’ die to a fully processed sample (not including package material)

Related Items


 

LatticeAx 220

The LatticeAx 220 is LatticeGear’s cleaving workhorse delivering 20-μm cleaving accuracy within 5-min


 

LatticeAx 120

Every user can cleave samples with wide variation of size, thickness and materials at high quality within 2-min.

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