The LatticeAx 220 is LatticeGear’s cleaving workhorse delivering 20-μm cleaving accuracy within 5-min
The LatticeAx 220 is LatticeGear’s cleaving workhorse delivering 20-μm accuracy with high surface quality in 5-min. It combines the patent pending LatticeAx base with a digital microscope and real-time image acquisition and display software (SW) and a robust industrial set of stand and poles to offer the most ease of use and repeatable results by any user. The LatticeAx220 accepts samples with a wide range size, thickness and material.
USB digital microscope, a real-time image acquisition and display software*
110 or 220. Price varies, so please specify when requesting a quote.
Flat stage with vacuum to hold the sample in place during indentation.
Using the indenter knob, create a pristine, controlled surface indentation: L-1mm (from leading edge), W- 10um, D- shallow / user selection.
Using the cleaving bar and turning knob, cleave slowly and controllably perpendicular to the primary sample axis, from the indentation.
Full set-indent-cleave – min 9mm width / For < 9mm, use the Ax to set-indent
1/2 of 12” wafer
‘out of the package’ die to a fully processed sample (not including package material)
LatticeAx420 is LatticeGear’s highest performance cleaving solution. It integrates LatticeGear's custom designed, stable, small footprint workstation and vision package with 4-μm optical resolution and precise focus control to cleave with 10-um accuracy in <5-min.
Every user can cleave samples with wide variation of size, thickness and materials at high quality within 2-min.
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