Every user can cleave samples with wide variation of size, thickness and materials at high quality within 2-min.
By using the Patent Pending LatticeAx base platform, every user can cleave samples with wide variation in size, thickness and materials at high quality within 2-min. It uses precision knobs to produce fine, reproducible surface indentation followed by slow, controlled cleaving. The indenter is controlled by a stage with 5-μm steps. Combine this tool with your own optical microscope to improve cleaving accuracy.
Determined by the scope and software you provide.
Combine this tool with your own optical microscope to improve cleaving accuracy.
Flat stage with vacuum to hold the sample in place during indentation.
Using the indenter knob, create a pristine, controlled surface indentation: L-1mm (from leading edge), W- 10um, D- shallow / user selection.
Using the cleaving bar and turning knob, cleave slowly and controllably perpendicular to the primary sample axis, from the indentation.
Full set-indent-cleave – min 9mm width / For < 9mm, use the Ax to set-indent
1/2 of 12” wafer
‘out of the package’ die to a fully processed sample (not including package material)
The LatticeAx 220 is LatticeGear’s cleaving workhorse delivering 20-μm cleaving accuracy within 5-min
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