You’ll flip when you see this: perfectly straight back side scribe lines for clean cleaves through front side targets. FlipScribeTM from LatticeGear takes scribing to a new performance level, letting users make clean, straight scribe lines on the back side of substrates- repeatably- for accurate cleaving of frontside targets. The ideal solution for making cross sections and downsizing bonded wafers, crystalline and amorphous materials, FlipScribe helps eliminate contamination of sensitive front side devices.
LatticeAx420 is LatticeGear’s highest performance cleaving solution. It integrates LatticeGear's custom designed, stable, small footprint workstation and vision package with 4-μm optical resolution and precise focus control to cleave with 10-um accuracy in <5-min.
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