FlipScribe takes scribing to a new performance level, making clean, straight scribe lines on the back side to accurately cleave front side targets, bonded wafers and other substrates. This method eliminates contamination of sensitive front side devices during the scribing processes and is especially valuable for crystalline and amorphous samples.
Scribing Reinvented FlipScribe back side scriber is a compact, stable, accurate, fast and low cost scribing and cleaving solution suitable for any lab; no utilities required. It provides a more accurate method for scribing than can be achieved with hand held tools, by integrating a robust diamond scribe into a sample platform with a fence guide design. Time required to align and scribe is about a minute. It allows users to accurately position the scribe mark relative to features on the front side, visualized either by eye or with a user-supplied high magnification microscope. FlipScribe also offers a quick method for cleanly downsizing large samples, with a “scribe stop” to allow the operator to define the length of the scribe.
Cleaving accuracy ± 200 μm
Cleaving cycle time 1-2 minutes
Minimum sample size 3/8”(L) x 1⁄4”(W) x 300 μm (T)
Maximum sample size Wafer: 4” (100 mm); 1⁄4 -12” (300 mm). Non-wafer:3/8”/ 9.5 mm(L) x 1⁄4”/6.3 mm(W) x .01”/300 μm (H)
Diamond Scribe Pre-installed diamond scriber
LatticeAx420 is LatticeGear’s highest performance cleaving solution. It integrates LatticeGear's custom designed, stable, small footprint workstation and vision package with 4-μm optical resolution and precise focus control to cleave with 10-um accuracy in <5-min.
The LatticeAx 220 is LatticeGear’s cleaving workhorse delivering 20-μm cleaving accuracy within 5-min
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