You’ll flip when you see this: perfectly straight back side scribe lines for clean cleaves through front side targets. FlipScribeTM from LatticeGear takes scribing to a new performance level, letting users make clean, straight scribe lines on the back side of substrates- repeatably- for accurate cleaving of frontside targets. The ideal solution for making cross sections and downsizing bonded wafers, crystalline and amorphous materials, FlipScribe helps eliminate contamination of sensitive front side devices.
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FlipScribe takes scribing to a new performance level, making clean, straight scribe lines on the back side to accurately cleave front side targets, bonded wafers and other substrates. This method eliminates contamination of sensitive front side devices during the scribing processes and is especially valuable for crystalline and amorphous samples.
LatticeAx420 is LatticeGear’s highest performance cleaving solution. It integrates LatticeGear’s custom designed, stable, small footprint workstation and vision package with 4-μm optical resolution and precise focus control to cleave with 10-um accuracy in <5-min.
The LatticeAx 220 is LatticeGear’s cleaving workhorse delivering 20-μm cleaving accuracy within 5-min
Every user can cleave samples with wide variation of size, thickness and materials at high quality within 2-min.
Samples were cleaved and imaged directly in the SEM. Because TSVs can be up to 100 microns deep with aspect ratios of up to 1:20 or greater, cross-sectional examination in the SEM is the analysis method of choice. Cleaving is a fast, clean method of preparing TSV samples for inspection.
Cross section of SEMATECH 5x50 micron TSVs. A single tool (LatticeAx) process was used to simply cleave through the etched vias and the image in the SEM without any other preparation.
A multi-tool process was used to prepare cross sections of copper bumps. The LatticeAx was used to cleave close to a specific row of copper bumps for quick, final broad argon ion beam milling.
Cross sections of photoresist are critical in understanding a lithographic process. The LatticeAx was used to cleanly cleave photoresist. The sample was cleaved and then coated with a conductive film and examined in an SEM.
Thin samples prepared by scribing the entire length of the sample and cleaving using the FlipScribe.
“…Like having a piece of wafer too wide to fit in the SEM. Before we would grind the sample to size rather than risk cleaving off a sliver. And grinding takes time, contaminates the sample, and oxidizes the sample face…”
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